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ap2501/ap2511 document number: ds35577 rev. 6 - 2 1 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 2.5a single channel current-limited power switch description the ap2501 and ap2511 are single channel current-limited integrated high-side power switches optimized for universal serial bus (usb) and other hot-swap applications. the family of devices complies with usb standards and is available with both polarities of enable input. the devices have fast short-circ uit response time for improved overall system robustness, and have integrated output discharge function to ensure completely controlled discharging of the output voltage capacitor. they provide a complete protection solution for applications subject to heavy capac itive loads and the prospect of short circuit, and offer reverse curr ent blocking, over-current, over- temperature and short-circuit protec tion, as well as controlled rise time and under-voltage lockout functionality. a 7ms deglitch capability on the open-drain flag out put prevents false over-current reporting and does not require any external components. all devices are available in so-8, msop-8, msop-8ep, u-dfn3030-8 and u-dfn2020-6 packages. features ? single channel current-limited power switch ? output discharge function ? fast short-circui t response time: 2s ? 3.7a accurate current limiting (typ) ? reverse current blocking ? 70m ? on-resistance (typ) ? input voltage range: 2.7v ? 5.5v ? built-in soft-start with 0.6ms typical rise time ? over-current and thermal protection ? fault report (flg) with blanking time (7ms typ) ? esd protection: 2kv hbm, 200v mm ? active low (ap2501) or active high (ap2511) enable ? ambient temperature range: -40c to +85c ? so-8, msop-8, msop-8ep, u-dfn3030-8 and u-dfn2020-6: available in ?green? molding compound (no br, sb) ? lead-free finish; rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) ? ul recognized, file number e322375 ? iec60950-1 cb scheme certified pin assignments flg out out nc gnd in in en 1 2 3 4 8 7 6 5 (top view) u-dfn3030-8 type e (top view) (so-8) nc out out flg in in gnd en (top view) u-dfn2020-6 flg out out nc gnd in in en (top view) msop-8/msop-8ep note: latter with exposed pad (dotted line) 8 7 6 5 1 2 3 4 applications ? lcd tvs & monitors ? set-top-boxes, residential gateways ? laptops, desktops, servers, e-readers ? printers, docking stations, hubs notes: 1. eu directive 2002/95/ec (rohs) & 2011/65/eu (roh s 2) compliant. all applicable rohs exemptions applied. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. ? green
ap2501/ap2511 document number: ds35577 rev. 6 - 2 2 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 typical applications circuit 0.1uf in gnd en out on 120uf power supply 2.7v to 5.5v 0.1uf off flg load 10k enable active high (ap2511) available options part number channel enable pin (en) recommended maximum continuous load current (a) typical current limit (a) package ap2501 1 active low 2.5a 3.7a so-8 msop-8 msop-8ep u-dfn3030-8 u-dfn2020-6 ap2511 1 active high pin descriptions pin name pin number function msop-8ep, u-dfn3030-8 so-8, msop-8 u-dfn2020-6 gnd 1 1 2 ground in 2, 3 2, 3 1 voltage input pin. connect a 0.1f or larger ceramic capacitor from in to gnd as close as possible. (all in pi ns must be tied together externally) en 4 4 3 enable input. active low (ap2501) or active high (ap2511). flg 5 5 4 over-temperature and over-current fault reporting with 7ms deglitch; active low open-drain output. flg is disabled for 7ms after turn-on. out 6, 7 6, 7 5 voltage output pin (all out pins must be tied together externally) nc 8 8 6 no internal connection; recommend tie to out pins. exposed pad exposed pad not applicable exposed pad exposed pad. it should be externally connected to gnd and thermal mass for enhanced thermal impedance. it should not be used as electrical ground conduction path.
ap2501/ap2511 document number: ds35577 rev. 6 - 2 3 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 functional block diagram thermal sense flg out gnd in en uvlo current limit current sense deglitch discharge control driver absolute maximum ratings (@t a = +25c, unless otherwise specified.) symbol parameter rating unit esd hbm human body model esd protection 2 kv esd mm machine model esd protection 200 v v in input voltage (note 4) -0.3 to +6.5 v v out output voltage (note 4) -0.3 to 6.5 or v in +0.3 v v en , v flg enable voltage (note 4) -0.3 to 6.5 or v in +0.3 v i load maximum continuous load current internal limited a t jmax maximum junction temperature 150 c t st storage temperature range (note 5) -65 to +150 c notes: 4. all voltages referred to gnd pin. maximums are the lower of v in + 0.3 and 6.5v 5. ul recognized rating from -30c to +70c (diodes qualified t st from -65c to +150c) caution: stresses greater t han the 'absolute maximum ratings' specified above, may cause permanent damage to the device. these are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is n ot implied. device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. semiconductor devices are esd sensitive and may be damaged by ex posure to esd events. suitable esd precautions should be taken when handling and transporting these devices recommended operating conditions (@t a = +25c, unless otherwise specified.) symbol parameter min max unit v in input voltage 2.7 5.5 v i out output current 0 2.5 a v ih high-level input voltage on en 2.0 v in v v il low-level input voltage on en 0 0.8 v t a operating ambient temperature (note 6), -40 +85 c note: 6. t a(max) = +70c if v in 4.1v and i out = 2.5a to keep device from going into thermal protection.
ap2501/ap2511 document number: ds35577 rev. 6 - 2 4 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 electrical characteristics (@ t a = +25c, v in = +5.0v, c in = 0.1f, c l = 1f,unless otherwise specified.) symbol parameter conditions (note 7) min typ max unit v uvlo input uvlo v in rising 1.6 2.0 2.4 v v uvlo input uvlo hysteresis v in decreasing 50 mv i shdn input shutdown current disabled, out = open 0.1 1.0 a i q input quiescent current enabled, out = open 60 100 a i leak input leakage current disabled, out grounded 0.1 1.0 a i rev reverse leakage current disabled, v in = 0v, v out = 5v, i rev at v in 0.01 1.00 a r ds(on) switch on-resistance v in = 5v, i out = 1a t a = 25 o c 70 78 m ? -40c t a 85c 105 v in = 3.3v, i out = 1a t a = 25 o c 90 108 -40c t a 85c 135 i limit over-load current limit (note 7) v in = 5v, v out = 4.5v -40c t a 85c 2.8 3.7 4.6 a i trig current limiting trigger threshold output current slew rate (<100a/s) 3.7 a i short short-circuit current limit enabl ed into short circuit 3.7 a t short short-circuit response time v out = 0v to i out = i limit (out shorted to ground) 2 s v il en input logic low voltage v in = 2.7v to 5.5v 0.8 v v ih en input logic high voltage v in = 2.7v to 5.5v 2 v i leak-en en input leakage v in = 5v, v en = 0v and 5.5v 0.01 1.00 a i leak-o output leakage current disabled, v out = 0v 0.5 1 a t d(on) output turn-on delay time c l = 1f, r load = 5 ? 0.1 ms t r output turn-on rise time c l = 1f, r load = 5 ? 0.6 1.5 ms t d(off) output turn-off delay time c l = 1f, r load = 5 ? 0.1 ms t f output turn-off fall time c l = 1f, r load = 5 ? 0.05 0.10 ms r flg flg output fet on-resistance i flg = 10ma 20 40 ? i foh flg off current v flg = 5v 0.01 1.00 a t blank flg blanking time assertion or deassertion due to overcurrent and over-temperature condition 4 7 15 ms t dis discharge time c l = 1f, v in = 5v, disabled to v out < 0.5v 0.6 ms r dis discharge resistance (note 8) v in = 5v, disabled, i out = 1ma 100 ? t shdn thermal shutdown threshold enabled 140 ? c t hys thermal shutdown hysteresis 20 ? c ja thermal resistance junction-to- ambient so-8 (note 9) 96 ? c/w msop-8 (note 9) 130 ? c/w msop-8ep (note 10) 92 ? c/w u-dfn3030-8 (note 10) 84 ? c/w u-dfn2020-6 (note 11) 90 ? c/w notes: 7. pulse-testing techniques maintain junction temperatur e close to ambient temperature; thermal effects must be taken into account separately. 8. the discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down w hen v in < v uvlo ). the discharge function offers a resistive discharge path for the external storage capacitor for limited time. 9. device mounted on 2? x 2? fr-4 substr ate pcb, 2oz copper, with minimum recommended pad layout. 10. device mounted on 2? x 2? fr-4 substrate pcb, 2o z copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 11. device mounted on 1"x1" fr-4 substrate pcb, 2oz c opper, with minimum recommended padon top layer and thermal vias to bo ttom layer ground
ap2501/ap2511 document number: ds35577 rev. 6 - 2 5 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 typical performance characteristics v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f figure 1 voltage waveforms: ap2501 (left), ap2511 (right) all enable plots are for enable active low turn-off delay and fall time t a =25c vin=5v cl=120uf rout=2.5 ? vout 2v/div ven 5v/div iin 1a/div device disable turn-on delay and rise time t a =25c vin=5v cl=120uf rout=2.5 ? vout 2v/div ven 5v/div iin 1a/div device enable turn-off delay and fall time t a =25c vin=5v cl=1uf rout=2.5 ? vout 2v/div ven 5v/div iin 1a/div device disable turn-on delay and rise time t a =25c vin=5v cl=1uf rout=2.5 ? vout 2v/div ven 5v/div iin 1a/div device enable
ap2501/ap2511 document number: ds35577 rev. 6 - 2 6 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 typical performance characteristics (cont.) vout 2v/div short-circuit to no-load recovery response iin 2a/div flg 5v/div t a =25c vin=5v output short circuit removed short circuit present device thermal cycles t a =25c vin=5v vout 2v/div flg 5v/div iin 2a/div no-load to short-circuit transient response output short circuit device enable current-limit vout 2v/div short-circuit to full-load recovery response iin 2a/div flg 5v/div t a =25c vin=5v rout=2 ? output short circuit removed short circuit present device thermal cycles t a =25c vin=5v rout=2 ? vout 2v/div flg 5v/div iin 2a/div full-load to short-circuit transient response output short circuit device turns off and re-enables into current-limit inrush current t a =25c vin=5v cl=120uf,220uf,470uf rout=2.5 ? ven 5v/div iin 1a/div cl=120uf cl=220uf cl=470uf device enabled into short-circuit t a =25c vin=5v cl=120uf rout=1 ? ven 5v/div iin 1a/div
ap2501/ap2511 document number: ds35577 rev. 6 - 2 7 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 typical performance characteristics (cont.) vin 2v/div uvlo decreasing t a =25c vin=5v rout=33 ? cl=120uf vout 2a/div vout 2v/div vin 2a/div uvlo increasing t a =25c vin=5v rout=33 ? cl=120uf vout 5v/div short-circuit with blanking time and recovery iout 2a/div flg 5v/div t a =25c vin=5v t a =25c vin=5v rout=2.5 ? cl=120uf vout 5v/div flg 5v/div iout 1a/div power on vin 5v/div
ap2501/ap2511 document number: ds35577 rev. 6 - 2 8 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 typical performance characteristics (cont.) 3.5 3.0 2.0 2.5 6.0 5.0 4.0 4.5 5.5 input voltage (v) turn-off time vs. input voltage t u r n - o f f t ime (s) 180 200 160 140 120 100 80 60 40 20 0 c = 1f r = 5 t = 25c l l a ? 3.5 3.0 2.0 2.5 6.0 5.0 4.0 4.5 5.5 input voltage (v) rise time vs. input voltage tu r n- o n time (s) 900 1000 800 700 600 500 400 300 200 100 0 c = 1f r = 5 t = 25c l l a ? 3.5 3.0 2.0 2.5 6.0 5.0 4.0 4.5 5.5 input voltage (v) rise time vs. input voltage fall time (s) 90 100 80 70 60 50 40 30 20 10 0 c = 1f r = 5 t = 25c l l a ? temperature ( c) supply current, output enabled vs. temperature ? -50 -25 0 25 50 75 100 125 0 10 20 30 40 50 60 70 80 90 100 v = 5v in v = 5.5v in v =3.3v in v = 2.7v in supply current output enabled (a) temperature ( c) supply current, output disabled vs. temperature ? -50 -25 0 25 50 75 100 125 s u p p l y c u r r e n t o u t p u t disabled (a) -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -0.20 -0.25 -0.30 v = 5v in v = 5.5v in v =3.3v in v = 2.7v in 3.5 3.0 2.0 2.5 6.0 5.0 4.0 4.5 5.5 input voltage (v) turn-on time vs. input voltage 0 10 20 30 40 50 60 70 80 90 130 140 150 100 110 120 t u r n- o n ti m e (s) c = 1f r = 5 t = 25c l l a ?
ap2501/ap2511 document number: ds35577 rev. 6 - 2 9 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 typical performance characteristics (cont.) temperature ( c) r vs. temperature ? ds(on) -50 -25 0255075100125 v = 5v in v = 5.5v in v =3.3v in v = 2.7v in r (m) ds(on) ? 180 170 160 150 140 130 120 110 70 60 50 40 30 20 10 0 100 90 80 temperature ( c) short-circuit output current vs. temperature ? -50 -25 02550 75 100 125 v = 5v in v = 5.5v in v =3.3v in v = 2.7v in short-circuit output current(a) 4.5 4.4 4.3 4.2 4.1 4.0 3.9 3.5 3.4 33 3.2 3.1 3.0 3.8 3.7 3.6 temperature ( c) undervoltage lockout vs. temperature ? -50 -25 0255075100125 uvlo rising uvlo falling u n de r v o l t a g e l o c k o u t (v) 2. 2 2.1 2.0 1.9 1.8 1.7 1.6 input voltage (v) threshold trip current vs. input voltage 2.0 2.5 3.5 4.0 4.5 5.0 5.5 6.0 3.0 t h r es h o ld t r i p c u r r en t (a) 4. 5 4.4 4.3 4.2 4.1 3.8 3.7 3.6 3.5 4.0 3.9 c = 120f t = 25c l a
ap2501/ap2511 document number: ds35577 rev. 6 - 2 10 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 application note p ower supply considerations a 0.1 f to 2.2 f x7r or x5r ceramic bypass capacitor placed between in and gn d, close to the device, is recommended. when an external power supply is used, or an additional ferri te bead is added to the input, high inrush current may cause voltage spikes higher than the device maximum input rating during short circ uit condition. in this case a 2.2 f or bigger capacitor is recommended. placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. this prec aution reduces power-supply tra nsients that may cause ringing on the input. additiona lly, bypassing the output with a 0.1 f to 1.0 f ceramic capacitor improves the immunity of the device to short circuit transients. over-current and short circuit protection an internal sensing fet is employed to check for over-current conditi ons. unlike current-sense resistor s, sense fets do not inc rease the series resistance of the current path. when an over-current c ondition is detected, the device maintains a constant output curre nt and reduces the output voltage accordingly. complete shutdown occurs onl y if the fault stays long enough to activate thermal limiting. three possible overload conditions can occur. in the first condition, the output has been shorted to gnd before the device is e nabled or before vin has been applied. the ap2501/ap2511 senses the short circuit and immediat ely clamps output current to a certain safe level namely i limit . in the second condition, an output short or an overload occurs wh ile the device is enabled. at the instance the overload occur s, higher inrush current may flow for a very short period of time before the cu rrent limit function can react. t he input capacitor(s) rapidly di scharge through the device, activating current limit circuitry. protection is achieved by momentarily openi ng the p-mos high-side power switc h and then gradually turning it on. after the current limit function has tr ipped (reached the over-current tr ip threshold), the device sw itches into current limiting mode and the current is clamped at i limit . in the third condition, the load has been gradually increased beyond the recommended operating current. the current is permitte d to rise until the current-limit threshold (i trig ) is reached or until the thermal limit of the device is exceeded. the ap2501/ap2511 is capable of delivering current up to the current-limit threshold without damaging t he device. once the threshold has been reached, the device switches into its current limiting mode and is set at i limit . flg response when an over-current or over-temperature shutdown condition is encountered, the flg open-drain output goes active low after a n ominal 7-ms deglitch timeout. the flg output remains low until both ov er-current and over-temperature conditions are removed. connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, whic h does not trigger the flg due to the 7-ms deglitch timeout. the ap2501/ap2511 is designed to eliminate false over-current report ing without the need of external components to remove unwanted pulses. power dissipation and junction temperature the low on-resistance of the internal mosfet allows the small surface-mount packages to pass large current. using the maximum o perating ambient temperature (t a ) and r ds(on) , the power dissipation can be calculated by: p d = r ds(on) i 2 finally, calculate the junction temperature: t j = p d x r ? ja + t a where: t a = ambient temperature ? c r ? ja = thermal resistance p d = total power dissipation thermal protection thermal protection prevents the ic from damage when heavy-overload or short-circuit faults are present for extended periods of time. the ap2501/ap2511 implements a thermal sensing to monitor the operati ng junction temperature of the power distribution switch. once the die temperature rises to approximately 140c due to excessive power di ssipation in an over-current or short-circuit condition the i nternal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 20c before the swit ch turns back on. the switch continues to cycle in this mann er until the load fault or input power is removed. the flg open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
ap2501/ap2511 document number: ds35577 rev. 6 - 2 11 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 application note (cont.) under-voltage lockout (uvlo) under-voltage lockout function (uvlo) keeps the internal power switch from being turned on until the power supply has reached a t least 2v, even if the switch is enabled. whenever the input voltage falls bel ow approximately 2v, the power switch is quickly turned off. this facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. discharge function the discharge function of the devic e is active when enable is disabled or de-asse rted. the discharge function with the n-mos po wer switch implementation is activated and offers a re sistive discharge path for the external st orage capacitor. this is designed for dis charging any residue of the output voltage when either no external output resi stance or load resistance is present at the output. ordering information part number package code packaging 7?/13? tape and reel quantity part number suffix ap25x1s-13 s so-8 2500/tape & reel -13 ap25x1m8-13 m8 msop-8 2500/tape & reel -13 ap25x1mp-13 mp msop-8ep 2500/tape & reel -13 ap25x1fge-7 fge u-dfn3030-8 3000/tape & reel -7 ap25x1sn-7 sn u-dfn2020-6 3000/tape & reel -7 marking information (1) so-8
ap2501/ap2511 document number: ds35577 rev. 6 - 2 12 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 marking information (cont.) (2) msop-8 (3) msop-8ep (4) u-dfn3030-8 xx : identification code ( top view ) x : a~z : internal code x y xx w y : year : 0~9 w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week part number package identification code ap2501fge-7 u-dfn3030-8 bp ap2511fge-7 u-dfn3030-8 br (5) u-dfn2020-6 xx : identification code ( top view ) x : a~z : internal code x y xx w y : year : 0~9 w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week part number package identification code ap2501sn-7 u-dfn2020-6 dp ap2511sn-7 u-dfn2020-6 dr
ap2501/ap2511 document number: ds35577 rev. 6 - 2 13 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 package outline dimensions (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. 1. package type: so-8 2. package type: msop-8 so-8 dim min max a - 1.75 a1 0.10 0.20 a2 1.30 1.50 a3 0.15 0.25 b 0.3 0.5 d 4.85 4.95 e 5.90 6.10 e1 3.85 3.95 e 1.27 typ h - 0.35 l 0.62 0.82 ?? 0 ? 8 ? all dimensions in mm msop-8 dim min max typ a - 1.10 - a1 0.05 0.15 0.10 a2 0.75 0.95 0.86 a3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 d 2.90 3.10 3.00 e 4.70 5.10 4.90 e1 2.90 3.10 3.00 e3 2.85 3.05 2.95 e - - 0.65 l 0.40 0.80 0.60 a 0 8 4 x - - 0.750 y - - 0.750 all dimensions in mm gauge plane seating plane detail ?a? detail ?a? e e1 h l d e b a2 a1 a 45 7 ~ 9 a3 0.254 a a1 a2 e seating plane gauge plane l see detail c detail c c a e1 e3 a3 1 e y x d b 0.25 4 x 1 0 4 x 1 0
ap2501/ap2511 document number: ds35577 rev. 6 - 2 14 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 package outline dimensions (cont.) (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. 3. package type: msop-8ep 4. package type: u-dfn3030-8 type e 5. package type: u-dfn2020-6 msop-8ep dim min max typ a - 1.10 - a1 0.05 0.15 0.10 a2 0.75 0.95 0.86 a3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 d 2.90 3.10 3.00 d1 1.60 2.00 1.80 e 4.70 5.10 4.90 e1 2.90 3.10 3.00 e2 1.30 1.70 1.50 e3 2.85 3.05 2.95 e - - 0.65 l 0.40 0.80 0.60 a 0 8 4 x - - 0.750 y - - 0.750 all dimensions in mm u-dfn3030-8 type e dim min max typ a 0.57 0.63 0.60 a1 0 0.05 0.02 a3 ?? ?? 0.15 b 0.20 0.30 0.25 d 2.95 3.05 3.00 d2 2.15 2.35 2.25 e 2.95 3.05 3.00 e ?? ?? 0.65 e2 1.40 1.60 1.50 l 0.30 0.60 0.45 z ?? ?? 0.40 all dimensions in mm u-dfn2020-6 dim min max typ a 0.57 0.63 0.60 a1 0 0.05 0.03 a3 ?? ?? 0.15 b 0.20 0.30 0.25 d 1.95 2.075 2.00 d2 1.45 1.65 1.55 e ?? ?? 0.65 e 1.95 2.075 2.00 e2 0.76 0.96 0.86 l 0.30 0.40 0.35 all dimensions in mm b (x8) e l (x8) a1 a3 z (x4) d d2 e2 e a 1 d a a1 a2 e e y x seating plane gauge plane l d 8xb see detail c detail c c a e1 e3 a3 e2 4 x 1 0 4 x 1 0 0.25 d1 seating plane d2 d e pin#1 id l b d2/2 e2 e a1 a a3
ap2501/ap2511 document number: ds35577 rev. 6 - 2 15 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (1) package type: so-8 (2) package type: msop-8 (3) package type: msop-8ep dimensions value (in mm) x 0.60 y 1.55 c1 5.4 c2 1.27 dimensions value (in mm) c 0.650 x 0.450 y 1.350 y1 5.300 dimensions value (in mm) c 0.650 g 0.450 x 0.450 x1 2.000 y 1.350 y1 1.700 y2 5.300 x c y y1 x c1 c2 y g x c y y2 y1 x1
ap2501/ap2511 document number: ds35577 rev. 6 - 2 16 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 suggested pad layout (cont.) please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (4) package type: u-dfn3030-8 type e (5) package type: u-dfn2020-6 dimensions value (in mm) c 0.65 c1 2.35 x 0.30 y 0.65 y1 1.60 y2 2.75 dimensions value (in mm) z 1.67 g 0.15 x1 0.90 x2 0.45 y 0.37 c 0.65 y (x8) x (x8) c c1 y1 y2 g g yc z y x2 x1
ap2501/ap2511 document number: ds35577 rev. 6 - 2 17 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 taping orientation (note 12) for u-dfn2020-6 and u-dfn3030-8 type e note: 12. the taping orientation of the other package type c an be found on our website at http://www.diodes .com/datasheets/a p02007.pdf
ap2501/ap2511 document number: ds35577 rev. 6 - 2 18 of 18 www.diodes.com march 2013 ? diodes incorporated ap2501/ap2511 important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product described herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does diodes incor porated convey any license under its patent or trademark rights, nor the rights of others. any customer or us er of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose pr oducts are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or un authorized application, customers shall i ndemnify and hold diodes incorporated and its representat ives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into mu ltiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2013, diodes incorporated www.diodes.com

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